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| SPD50N03S2-07 G OptiMOS(R) Power-Transistor Feature * N-Channel Product Summary VDS R DS(on) ID 30 7.3 50 PG-TO252-3 V m A * Enhancement mode * Excellent Gate Charge x RDS(on) product (FOM) * Superior thermal resistance * 175C operating temperature * Avalanche rated * dv/dt rated Pb-free lead plating; RoHS compliant Type Package SPD50N03S2-07 G PG-TO252-3 Marking PN0307 Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Continuous drain current1) TC=25C Symbol ID Value 50 50 Unit A Pulsed drain current TC=25C ID puls EAS EAR dv/dt VGS Ptot T j , Tstg 200 250 13 6 20 136 -55... +175 55/175/56 kV/s V W C mJ Avalanche energy, single pulse ID=50 A , V DD=25V, RGS=25 Repetitive avalanche energy, limited by Tjmax 2) Reverse diode dv/dt IS=50A, VDS=24V, di/dt=200A/s, T jmax=175C Gate source voltage Power dissipation TC=25C Operating and storage temperature IEC climatic category; DIN IEC 68-1 Page 1 02-09-2008 SPD50N03S2-07 G Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 3) Symbol min. RthJC RthJA RthJA - Values typ. 0.7 max. 1.1 100 75 50 Unit K/W Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage V GS=0V, ID=1mA Symbol min. V(BR)DSS VGS(th) IDSS IGSS RDS(on) 30 2.1 Values typ. 3 max. 4 Unit V Gate threshold voltage, VGS = V DS ID=85A Zero gate voltage drain current V DS=30V, VGS=0V, Tj=25C V DS=30V, VGS=0V, Tj=125C A 0.01 1 1 5.7 1 100 100 7.3 nA m Gate-source leakage current V GS=20V, VDS=0V Drain-source on-state resistance V GS=10V, I D=50A 1Current limited by bondwire ; with an RthJC = 1.1K/W the chip is able to carry ID= 106A at 25C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Defined by design. Not subject to production test. 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2 02-09-2008 SPD50N03S2-07 G Electrical Characteristics Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg VDD =24V, ID =50A, VGS =0 to 10V VDD =24V, ID =50A Symbol Conditions min. Values typ. 60 1630 750 150 14 36 27 25 max. - Unit gfs Ciss Coss Crss td(on) tr td(off) tf VDS 2*ID *RDS(on)max, ID =50A VGS =0V, VDS =25V, f=1MHz 30 - S 2170 pF 1000 230 21 54 40 38 ns VDD =15V, VGS =10V, ID =50A, RG =6.8 - 7.9 14.1 35 5.2 10.5 21.1 46.5 - nC V(plateau) VDD =24V, ID =50A V Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge ISM VSD trr Qrr V GS=0V, IF=50A V R=15V, I F=lS, diF/dt=100A/s IS TC=25C - 0.9 41 46 50 200 1.3 51 58 A V ns nC Page 3 02-09-2008 SPD50N03S2-07 G 1 Power dissipation Ptot = f (TC) parameter: VGS 6 V SPD50N03S2-07 2 Drain current ID = f (T C) parameter: VGS 10 V 55 SPD50N03S2-07 150 W A 45 40 120 110 P tot 100 90 80 70 60 ID 100 120 140 160 C 190 35 30 25 20 50 40 30 20 10 0 0 20 40 60 80 5 0 0 20 40 60 80 15 10 100 120 140 160 C 190 TC TC 3 Safe operating area ID = f ( VDS ) parameter : D = 0 , TC = 25 C 10 3 SPD50N03S2-07 4 Max. transient thermal impedance Z thJC = f (t p) parameter : D = t p/T 10 1 SPD50N03S2-07 K/W A /I D t = 7.6s p 10 s 10 0 V DS 10 2 DS (on ) Z thJC 100 s ID = R 10 -1 D = 0.50 10 10 1 1 ms -2 0.20 0.10 0.05 10 -3 single pulse 0.02 0.01 10 0 10 -1 10 0 10 1 V 10 2 10 -4 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 VDS Page 4 tp 02-09-2008 SPD50N03S2-07 G 5 Typ. output characteristic ID = f (V DS); T j=25C parameter: tp = 80 s 120 SPD50N03S2-07 6 Typ. drain-source on resistance RDS(on) = f (I D) parameter: VGS 24 SPD50N03S2-07 Ptot = 136W i V [V] GS a b A 100 90 80 h 4.2 4.5 4.8 5.0 5.2 5.5 5.8 6.0 10.0 m 20 e f g h c d e R DS(on) 18 16 14 12 10 8 ID 70 60 50 40 30 20 10 0 0 1 2 3 c a b e g f g h i f 6 d i 4 VGS [V] = 2 e 5.2 f 5.5 g 5.8 h i 6.0 10.0 4 V 0 5.5 0 10 20 30 40 50 60 70 80 A 100 VDS ID 7 Typ. transfer characteristics ID= f ( V GS ); V DS 2 x ID x RDS(on)max parameter: tp = 80 s 100 8 Typ. forward transconductance g fs = f(I D); T j=25C parameter: g fs 80 A 80 S 60 70 g fs V 6.5 VGS ID 60 50 40 30 50 40 30 20 20 10 0 0 1 2 3 4 5 10 0 0 20 40 60 80 A ID 120 Page 5 02-09-2008 SPD50N03S2-07 G 9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 50 A, VGS = 10 V 17 SPD50N03S2-07 10 Typ. gate threshold voltage VGS(th) = f (T j) parameter: VGS = VDS 4 m 14 V 415 A V GS(th) 3 R DS(on) 12 2.5 83 A 10 98% 8 6 4 2 typ 2 1.5 1 0.5 0 -60 -20 20 60 100 140 C 200 0 -60 -20 20 60 100 C Tj 180 Tj 11 Typ. capacitances C = f (V DS) parameter: VGS=0V, f=1 MHz 10 4 12 Forward character. of reverse diode IF = f (V SD) parameter: T j , tp = 80 s 10 3 SPD50N03S2-07 A pF Ciss 10 2 C 10 3 Coss IF 10 1 T j = 25 C typ T j = 175 C typ Crss T j = 25 C (98%) T j = 175 C (98%) 10 2 10 5 10 15 20 0 0 V 30 0 0.4 0.8 1.2 1.6 2 2.4 V 3 VDS Page 6 VSD 02-09-2008 SPD50N03S2-07 G 13 Typ. avalanche energy E AS = f (T j) par.: I D = 50 A , V DD = 25 V, R GS = 25 260 14 Typ. gate charge VGS = f (QGate) parameter: ID = 50 A pulsed 16 SPD50N03S2-07 mJ V 220 200 12 E AS VGS 180 160 140 10 0,2 VDS max 0,8 VDS max 8 120 100 80 60 40 20 0 25 45 65 85 105 125 145 4 6 2 C 185 Tj 0 0 10 20 30 40 nC 55 QGate 15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: ID=10 mA 36 SPD50N03S2-07 V V(BR)DSS 34 33 32 31 30 29 28 27 -60 -20 20 60 100 140 C 200 Tj Page 7 02-09-2008 SPD50N03S2-07 G Package outline: PG-TO252-3 Page 8 02-09-2008 SPD50N03S2-07 G Page 9 02-09-2008 |
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